The most critical challenge in overmolding is poor adhesion between the thermoplastic elastomer (TPE) and the substrate, which is typically an engineering thermoplastic (ETP). The bond is largely determined by the compatibility of the two materials, which is why material selection is so important. Take advantage of our experience in manufacturing both TPEs and ETPs, and adhesion-modifying these materials to work together for the most optimal bond strengths.

Teknor Apex is pleased to bring you the next generation of thermoplastic elastomers (TPEs) for overmolding: Monprene OM Series.  Download this product selector guide and choose the right grade for your application using our compatibility table. 

The Monprene® OM series is formulated to adhere to many engineering resins:

• PC, ABS, PC/ABS Blends

• Polyamide (Nylon 6, 66, 12, etc.)

• Polystyrene (GPPS, HIPS, blends)

• Polyacrylate (PMMA, MBS, ASA, etc.)

• Copolyester (Tritan™)

• POM (Polyoxymethylene/polyacetal)

• SAN (Styrene acrylonitrile)

• PBT (Polybutylene terephthalate)